Project Outline
     If you have a 3D IC, you might find that one of the die in the stack is broken. If you don't want to throw out the whole stack, you would need to repair it. One way to do this might be using an FPGA that is also in the stack. Can you figure out a way to partition the device in such a way that you can replace part of the chip with an FPGA without losing too much performance.